Copper is apt to be oxidized during the IC assembly process. Higher oxide content will increase the electrical resistance and is detrimental to reliability of IC.

E&R’s plasma system can completely reduce the copper oxide at the low temperature in order to prevent the unwanted warpage of the adjacent polymer sheet, e.g. embedded FPCB sheet, 600x600mm.

Copper oxidized, lead-frame, Before plasma treatment

Copper reduced, lead-frame, After plasma treatment